NDLI: Micropipette-based thermal sensor for biological applications

Content Provider	IEEE Xplore Digital Library
Author	Shrestha, R. Choi, T.Y. Chang, W.S.
Copyright Year	2010
Description	Author affiliation: Department of Mechanical and Energy Engineering, University of North Texas, Denton 76203 USA (Shrestha, R.; Choi, T.Y.) \|\| Department of Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Korea (Chang, W.S.)
Abstract	We present herein a novel technique for the fabrication of a glass micropipette thermal sensor utilizing inexpensive thermocouple materials and we are capable of measuring thermal fluctuation with accuracy of ± 0.002 degree Celsius. We produced and tested various sensors in the sensing tip size, which ranges from 5 µm to 30 µm. The sensors comprise unleaded low melting point solder alloy (Sn) as a core metal inside a borosilicate glass pipette and thin film of nickel coated outside, creating a thermocouple junction at the tip. The sensor was calibrated by using a thermally insulated calibration chamber, the temperature of which can be controlled with precision of ± 0.1 °C, and the thermoelectric power (Seebeck coefficient) of the sensor was recorded from 8.46 to 8.86 µV/°C. The sensor we have produced is cost-effective and reliable in application for thermal conductivity measurement of micro-electro-mechanical systems (MEMS), and biological temperature sensing in micro level.
Starting Page	442
Ending Page	445
File Size	549403
Page Count	4
File Format	PDF
ISBN	9781424481705
ISSN	19300395
e-ISBN	9781424481699
e-ISBN	9781424481682
DOI	10.1109/ICSENS.2010.5690185
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature measurement Temperature sensors Junctions Nickel Coatings Glass
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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