NDLI: Chip-scale IMU using folded-mems approach

Content Provider	IEEE Xplore Digital Library
Author	Zotov, S.A. Rivers, M.C. Trusov, A.A. Shkel, A.M.
Copyright Year	2010
Description	Author affiliation: MicroSystems Lab, Department of Mechanical and Aerospace Engineering, University of California at Irvine, USA (Zotov, S.A.; Rivers, M.C.; Trusov, A.A.; Shkel, A.M.)
Abstract	This paper reports a new approach to design and fabrication of chip-level inertial measurement units (IMUs). The folded-chip method utilizes a 3-D foldable silicon-on-insulator (SOI) backbone suitable for high-aspect ratio sensor fabrication. Assembly is done on the wafer level forming a compact rigid 6-axis system of sensors. Accelerometers and gyroscopes are fabricated in parallel with the folded structure on the same substrate, and are electrically and mechanically interfaced through integrated flexible polyimide film hinges and interlocking silicon latches. To demonstrate feasibility of the approach, folded IMUs are fabricated containing resonant capacitive accelerometers and gyroscopes. The value of the scale factor of the accelerometers is tunable over a range from 1.75 Hz/g to 3.7 Hz/g. Driving the gyroscope on the pyramid sidewall with 1.5 kHz operational frequency, the rotation rate is characterized in air to demonstrate operation with a scale factor of 0.43 mV/(deg/sec). Structural rigidity was verified by subjecting the IMU to oscillations from 50 Hz – 3.5 kHz over an amplitude range of 5 – 25 g. The results confirm feasibility of the proposed folded MEMS IMU approach, and may enable new integrated architectures for other multi-axis dynamic sensors, such as 3-D microphones, hydrophones, and ultrasonic transducers.
Starting Page	1043
Ending Page	1046
File Size	1177994
Page Count	4
File Format	PDF
ISBN	9781424481705
ISSN	19300395
e-ISBN	9781424481699
e-ISBN	9781424481682
DOI	10.1109/ICSENS.2010.5690800
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polyimides Accelerometers Fabrication Robot sensing systems Gyroscopes Acceleration Fasteners
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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