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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jia Xi Donglun Yang Lin Bai Xinduo Zhai Fei Xiao Hongyan Guo Li Zhang Chi Ming Lai |
| Copyright Year | 2013 |
| Description | Author affiliation: Jiangyin Changdian Adv. Packaging Co., Ltd., Jiangyin, China (Hongyan Guo; Li Zhang; Chi Ming Lai) || Dept. of Mater. Sci., Fudan Univ., Shanghai, China (Jia Xi; Donglun Yang; Lin Bai; Xinduo Zhai; Fei Xiao) |
| Abstract | Wafer level chip scale packaging (WLCSP) is one of the most promising single chip packaging technologies due to advantages of fewer processing steps, lower cost, and enhanced device performance. Moreover, the redistribution layer (RDL) technology is an effective way to improve I/O density of IC packages. However, the reliability of WLP devices with RDL structure is greatly challenged as the pitch size going down. The RDL structure may affect the thermomechanical performance of the solder joints or silicon chips, thus causing unexpected failure. In this paper, RDL structured WLCSPs with pitch size of 500 μm were fabricated. The components with a size of 6×6 $mm^{2}$ were flip-chip bonded on FR-4 boards. Board level reliabilities of the WLCSP were evaluated by thermal shock test according to JEDEC standard. Furthermore, failure analysis was carried out to find out the failure mechanism and the failure related to the RDL structure was observed. The effect of RDL structure on the reliability of WLP was analyzed with the finite element simulations. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 1029 |
| Ending Page | 1032 |
| File Size | 586240 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756634 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electric shock Copper Semiconductor device reliability Failure analysis Stress Electronics packaging thermal shock WLCSP redistribution reliability |
| Content Type | Text |
| Resource Type | Article |
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