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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jing-Bo Zeng Guang-Sui Xu Min-Bo Zhou Xin-Ping Zhang |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Mater. Sci. & Eng., South China Univ. of Technol., Guangzhou, China (Jing-Bo Zeng; Guang-Sui Xu; Min-Bo Zhou; Xin-Ping Zhang) |
| Abstract | Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, $Cu)_{3}Sn_{4}$ IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the interfacial reaction; the interfacial IMC thicknesses of the aged joints with different heights were similar, while the volume fraction of IMC in the joints with a height of 25 μm was much higher than that of the joints with a height of 50 μm; the isothermal aging effect was much severer when the joints were undergone aging at 200 °C. In addition, β-Sn grains and $Ag_{3}Sn$ precipitates would grow coarsened during aging. Results of the tensile test showed that the joints aged at 125 °C had a similar ultimate tensile strength (UTS) despite the different heights of them; while the UTS of the joints aged at 200 °C degraded to 67%. The fracture of the aged joints was more likely to occur in the bulk solder in a ductile mode. The influence of the coarsening β-Sn matrix and $Ag_{3}Sn$ particles on the reliability of the aged joints was much stronger than that of the slow growth of the interfacial IMC. Ni/SAC/Ni joints with small heights showed better thermal reliability than that of the large ones. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 997 |
| Ending Page | 1004 |
| File Size | 3888995 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756628 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Joints Nickel Aging Tin Isothermal processes Morphology Microstructure Tensile fracture behavior Lead-free solder micro-interconnect Intermetallic compound Solder joint height |
| Content Type | Text |
| Resource Type | Article |
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