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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wenjun Chen Dunying Deng Fei Xiao |
| Copyright Year | 2013 |
| Description | Author affiliation: Dept. of Mater. Sci., Fudan Univ., Shanghai, China (Wenjun Chen; Dunying Deng; Fei Xiao) |
| Abstract | The main hurdle for the wide use of Ag-filled isotropically conductive adhesives (ICAs) is the high cost of Ag fillers. Copper can be a promising candidate for conductive metallic filler due to its low cost, high electrical conductivity and improved electro-migration performance compared to Ag. But the oxidation of copper dramatically increases the resistivity of copper-filled ICAs which considerably limits their applications. Lactic acid, glycolic acid and glutaric acid can react with the copper oxides surrounding copper particles to form copper salts which then can be reduced to copper in the annealing process. In this paper, the copper particles were treated with a variety of organic acid in ethanol. The anti-oxidative copper particles were then mixed with epoxy and the corresponding acid to prepare the electrically conductive pastes which were deposited on glass slides and cured at proper temperatures. The bulk resistivity of the copper filled ICA with a filler loadings of 67 wt.% reached 1.2×10 $^{4}$ Ω·cm. The curing behavior was analyzed by DSC. The effects of the acids on the electrical resistivity and the microstructure of the samples were studied. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 288 |
| Ending Page | 291 |
| File Size | 1062749 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756473 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Copper Conductivity Curing Surface treatment Conductive adhesives Nitrogen epoxy resin isotropically conductive adhesives organic acid electronic packaging copper particles |
| Content Type | Text |
| Resource Type | Article |
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