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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lulu Shi Qian Wang Yu Chen Lin Tan Jian Cai Xin Gu Shuidi Wang Jingwei Li Yang Hu |
| Copyright Year | 2013 |
| Description | Author affiliation: Inst. of Microelectron., Tsinghua Univ., Beijing, China (Lulu Shi; Qian Wang; Yu Chen; Lin Tan; Jian Cai; Shuidi Wang; Jingwei Li; Yang Hu) || Shennan Circuit Co., Ltd., Shenzhen, China (Xin Gu) |
| Abstract | Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been focused on the evaluation of bonding performance and reliability of Pd-coated copper wire bonding on ENEPIG substrate in this paper. Design of Experiment (DOE) had been performed to investigate effects of bonding parameters such as USG current, friction amplitude, friction frequency and force on shear strength and yield. The optimized parameter set was determined after comparison and analysis. Among four bonding parameters, friction amplitude showed more significant impact on bonding quality. High Temperature Storage (HTS) test had been carried out to inspect reliability of Pd-coated copper wire bonding on ENEPIG substrate. After thermal aging at 175°C for 128 hours, the Cu-Au interface showed excellent bonding performance. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 1014 |
| Ending Page | 1018 |
| File Size | 785092 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756631 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Wires Copper Substrates Friction Reliability Gold Yield Pd-coated Copper Wire ENEPIG Bonding Strength |
| Content Type | Text |
| Resource Type | Article |
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