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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ye Xie Dong Chen Li Zhang Tan, K.H. Lai, C.M. |
| Copyright Year | 2013 |
| Description | Author affiliation: Jiangyin Changdian Adv. Packaging Co., Ltd., Jiangyin, China (Ye Xie; Dong Chen; Li Zhang; Tan, K.H.; Lai, C.M.) |
| Abstract | After the first white light-emitting diodes (WLEDs) became commercially available, much attention has been paid to the development of WLEDs because of their extensive applications in solid lighting. Compared with traditional lighting, WLEDs have more advantages, such as high efficiency, long lifetime, fast response and environmental-friendliness [1-3]. It has been widely used in signals, displays and lighting. However, high price is still the main block for its wide application. As a new LED packaging solution, wafer level packaging(WLP) has attracted more and more interesting for whole semiconductor industry for predictable advantages over traditional packaging types, WLP is an as-know low cost packaging method, which has been demonstrated in IC (integrated circuit) industry already [4-5]. In this paper, a novel packaging for white LED, benefit from Si material and TSV array used in the wafer level LED package, the capability of thermal dissipation could be enhanced. Compared to the traditional LED, there are many advantages of this package, The advantages of this 3D integration package are:(1) good thermal diffusivity, (2) good light efficiency, (3) less footprint. The structure of the packaged LED was characterized, and light performance was tested according to standard LED testing method, and thermal resistance was simulated and tested, the result is close to Cree LED. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 1170 |
| Ending Page | 1174 |
| File Size | 675971 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756667 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Light emitting diodes Electronic packaging thermal management Thermal resistance Packaging Silicon Resists Phosphors simulation wafer level package through silicon via LED phosphor thermal resist |
| Content Type | Text |
| Resource Type | Article |
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