Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shujing Chen Kailin Pan Yu Guo Fei Yuan Xin Wang |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China (Shujing Chen; Kailin Pan; Yu Guo; Fei Yuan; Xin Wang) |
| Abstract | In order to improve the thermal fatigue lifetime of Package-on-Package (PoP), this paper taking PoP thermal reliability the cost and rework into consideration, different edge bonding structure (i.e. 100% edge bonding, 50% edge bonding, and 10% edge bonding) are used to improve thermal reliability. At the same time, the effect of different edge bonding patterns (i.e. only the bottom packege, or both the top and the bottom packeges) on the reliability is evaluated. We present that both edges bonding structure and edge bonding pattern have an effect on PoP thermal reliability by finite element analysis (FEA) under thermal cycling. After the analysis of the stress and the strain distribution, it was found that the outmost solder joint on bottom package was the most dangerous positon. Thermal fatigue lifetime of PoP with different edge bonding is analyzed based on plastic strain model by FEA. The study results reveal that edge bonding seems to have better contribution to PoP thermal reliability than underfilling, and the thermal fatigue lifetime of only bottom package edge bonded is longer than both the top and the bottom packages edge bonded, owing to the solder joints are overcommitted and the CTE of edge bonding epoxy is higher than substrate, PCB and solder joints. In addition, the thermal fatigue lifetime of 10% edge bonding is longest than others. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 1044 |
| Ending Page | 1047 |
| File Size | 856366 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756638 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Electronic packaging thermal management Strain Fatigue Soldering Stress Plastics thermal fatigue lifetime PoP edge bonding epoxy thermal cycling |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|