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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fengwei Dai Daquan Yu Jing Zhou He Ma Xiaomeng Wu Xiangmeng Jing Chongshen Song Hongwen He |
| Copyright Year | 2013 |
| Description | Author affiliation: Nat. Center for Adv. Packaging, Wuxi, China (Fengwei Dai; Daquan Yu; He Ma; Xiaomeng Wu; Xiangmeng Jing; Chongshen Song; Hongwen He) || Inst. of Microelectron., Beijing, China (Jing Zhou) |
| Abstract | In the paper, an equivalent modeling method is proposed to simplify thermal simulation model of 2.5D stacked dies modules. A TSV and its surrounding silicon substrate or a micro bump and its surrounding underfill will be equivalent to a single body of material. Through this method, we will not only be able to obtain thermal characteristics of each part of the stacked dies module, but also can greatly simplify the calculation amount of numerical simulation. According to this method, we obtained thermal distribution map of 2.5D/3D stacked dies module; in addition, to guide and optimize thermal management design, we analyzed the influence of several parameters on maximum junction temperature of 2.5D stacked dies as well, such as spacing among dies, thermal conductivity of TIM2 (Thermal Interface Material), ambient temperature, wind speed and so on. It was found that with the increase in spacing among dies, the maximum junction temperature of dies decreases and the maximum decreasing amplitude is 4.4°C. Secondly, impact on the maximum junction temperature of die, the ambient temperature of the cabinet is the most serious. Finally, the wind speed of the cabinet and the thermal conductivity of TIM2 (Thermal Interface Material) also have a great effect on the maximum junction temperature of die. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 498 |
| Ending Page | 502 |
| File Size | 422972 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756520 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity Conductivity Silicon Junctions Through-silicon vias Heating thermal distribution map TSV equivalent modeling method 2.5D stacked dies module |
| Content Type | Text |
| Resource Type | Article |
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