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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Weiqiang Li Haibin Chen Jingshen Wu Ke Xue Fei Wong Wai Keung Ng Guangxu Cheng |
| Copyright Year | 2013 |
| Description | Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China (Weiqiang Li; Haibin Chen; Jingshen Wu) || Sch. of Chem. Eng. & Technol., Xi'an Jiaotong Univ., Xi'an, China (Guangxu Cheng) || Package Innovation Hong Kong, NXP Semicond., Hong Kong, China (Ke Xue; Fei Wong; Wai Keung Ng) |
| Abstract | Wire bonding failures, including non-stick on die pad (bond-off) and smash ball of the first bond, are often encountered in manufacturing of miniaturized packages with increased feature density and higher UPH requirement. Many researches have been conducted with an attempt to solve these issues. However, these studies mainly focused on the correlations between bonding pad qualities and robust ball bonding solutions. Few of them investigated these failures from a mechanical point of view, such as deflection of leadframe under vertical bonding force. For today's small outline transistor (SOT) packages, the leadframe has low profiles and complex structures, which makes the wire bonding response very complex and difficult to be predicted. This paper demonstrated that the deflection of leadframe at the first bond position played an important role on the bond-off failure for SOT packages. When the deflection was larger than 5 μm at critical bonding locations, severe bond-off failure occurred. By applying finite element analysis, some ways to reduce this deflection thus eliminating the risk of bond-off failure were discussed and verified by experiments, which include leadframe structure modification at some local areas, change of supporting tape types, and lowering of bonding temperature. This work provides several guidelines for leadframe designers to achieve an optimized leadframe design of miniaturized packages, for the sake of improving wire bonding performances. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 425 |
| Ending Page | 430 |
| File Size | 864168 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756505 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Lead Wires Finite element analysis Bonding forces Simulation FEM Wire bonding non-stick on die pad |
| Content Type | Text |
| Resource Type | Article |
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