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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Huiqin Xie Jun Li Jian Song Fengze Hou Xueping Guo Shuling Wang Yu Daquan Cao Liqiang Lixi Wan |
| Copyright Year | 2013 |
| Description | Author affiliation: Microsyst. Packaging Res. Center, Inst. of Microelectron., Beijing, China (Huiqin Xie; Jun Li; Jian Song; Fengze Hou; Xueping Guo; Shuling Wang; Yu Daquan; Cao Liqiang; Lixi Wan) |
| Abstract | Portable consumer electronics have a tremendous demand of miniaturization, high density and high performance. 3D SIP is an efficient solution to meet this requirement. This paper had presented an innovative 3D package product configured with stacked die and cavity-embedded substrate. Through hole via in the substrate provides the signal communication at a cost-effective way. This structure satisfies the high standards for mobile products packaging by reducing the package size and cost and maintaining functionality. In this paper, some details on the design concepts of the structure are introduced. Then, since the geometric configuration of the bonding wire is unusual, the electrical performance of the wire bonds of the structure is predicted by HFSS. Though the wire bond is long, simulation results shows that it is still suitable for the speed circuits below 3GHz. On the other hand, the two-step cavity effectively improves the isolation capability between different die. Moreover, the fabrication process of this structure is presented in detail to access the design. Finally, the functional test of the end products is performed and the end products work well. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 64 |
| Ending Page | 67 |
| File Size | 512880 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756423 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wires Cavity resonators Substrates Bonding Packaging Three-dimensional displays Lamination three-step cavity 3D SIP-3 Dimension System in Package stacked die |
| Content Type | Text |
| Resource Type | Article |
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