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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wang Shenglong Sun Ling Sun Haiyan Yang Lingling Zhu Boyuan Lu Junwei |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Eng., Griffith Univ., Nathan, NSW, Australia (Zhu Boyuan; Lu Junwei) || Jiangsu Key Lab. of ASIC Design, Nantong Univ., Nantong, China (Wang Shenglong; Sun Ling; Sun Haiyan; Yang Lingling) |
| Abstract | An investigation of simultaneous switching noise (SSN) and electromagnetic compatibility (EMC) issues in a physical model of a system in package (SiP) is presented in this paper. SSN simulation is conducted in time domain with an extracted package model which contains package components, drivers and terminal resistors. In addition, electromagnetic interference (EMI) from the SiP is observed from far field and near field. Far-field simulation is performed in a simulated microwave anechoic chamber environment and near-field result is obtained by a near-field scan simulation. The simulation results show that by increasing number of drivers in SiP package will directly level up SSN which is acting as a major source of EMI. Therefore, capacitor placement in the SiP package is proposed for the purpose of SSN suppression and EMI reduction. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 622 |
| Ending Page | 625 |
| File Size | 437914 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756546 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Integrated circuit modeling Electromagnetic interference Electromagnetic compatibility Switches Capacitors Noise Decoupling Capacitor SSN EMC SiP |
| Content Type | Text |
| Resource Type | Article |
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