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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lin Qu Haitao Ma Huijing Zhao Ning Zhao Kunwar, A. Mingliang Huang |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China (Lin Qu; Haitao Ma; Huijing Zhao; Ning Zhao; Kunwar, A.; Mingliang Huang) |
| Abstract | By virtue of the synchrotron radiation imaging combing the analysis of the actual soldering morphology data in lab, we have a more specific understanding of the characteristic of nucleation and growth of $Ag_{3}Sn.$ In furnace cooling conditions, inside the pure Sn3.0Ag solder, there is no sheet $Ag_{3}Sn$ formed. The IMC at the soldering interface is a priority site for the nucleation of the $Ag_{3}Sn$ in the soldering interface reaction for the surface of $Cu_{6}Sn_{5}$ formed in soldering reaction providing the surface energy of nucleation and decreasing the energy needed for nucleation and growth. $Ag_{3}Sn$ grew around $Cu_{6}Sn_{5}$ inside the Sn3.5Ag solder in furnace cooling process. $Ag_{3}Sn$ embedded itself in $Cu_{6}Sn_{5},$ suppressing the growth of $Cu_{6}Sn_{5},$ and finally affecting the morphology of $Cu_{6}Sn_{5}.$ With the decrease of cooling rate, the size of $Ag_{3}Sn$ increases and the morphology transforms from nano particles to linear distribution with continuous structure, then to sheet morphology. The fast cooling rate provides large degree of supercooling for the nucleation of $Ag_{3}Sn;$ however the slow cooling rate offers abundant time for the diffusion of elements. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 377 |
| Ending Page | 381 |
| File Size | 1127268 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756493 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Cooling Soldering Furnaces Morphology Synchrotron radiation Imaging Tin cooling rate synchrotron radiation imaging Ag |
| Content Type | Text |
| Resource Type | Article |
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