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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhou Liangjie Huang Lin Wu Fengshun Liu Hui Xia Weisheng Fu Hongzhi Wang Shiyu Liu Zhe |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China (Zhou Liangjie; Huang Lin; Wu Fengshun; Liu Hui; Xia Weisheng) || Res. Dept. of Manuf. Technol., Zhongxing Telecommun. Equip. Corp., Shenzhen, China (Fu Hongzhi; Wang Shiyu; Liu Zhe) |
| Abstract | Solder bump joint has been accepted as a main FCOB interconnection method so far. To optimize the process conditions for achieving SAC305 solder bumped FCOB assembly with maximum die shear strength and allowable void rate, an orthogonal experimental design of four factors and three levels was carried out. The optimal process conditions are: 100 seconds for preheating time, 245 °C for peak temperature, 60 seconds for time above liquidus, flux paste as the auxiliary material. Three fracture modes were observed and categorized for samples after shear test based on the fracture interface location. The most frequently occurring fracture mode is the ductile. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 109 |
| Ending Page | 113 |
| File Size | 590909 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756434 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Force Flip-chip devices Electronics packaging Substrates shear strength flip chip on board lead-free reflow orthogonal experimental design |
| Content Type | Text |
| Resource Type | Article |
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