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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yuan Chen Na Lin |
| Copyright Year | 2013 |
| Description | Author affiliation: Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China (Na Lin) || Electron. Inst., Sci. & Technol. of Reliability Phys. & Applic. of Electron. Component Lab., MII, Guangzhou, China (Yuan Chen) |
| Abstract | System in Package (SiP) technology is rapidly evolved from specialty technology used in a narrow set of applications to a high volume technology with wide ranging impact on electronics markets. Numerous concepts for three dimensional (3D) SiP packaging are now emerging driven largely by the demands of portable consumer products. Conventional failure analysis techniques face a great challenge for SiP devices. 3D X-Ray technique can capture three-dimensional information about the internal structure of an object. It is very useful for 3D SiP failure analysis. This paper introduced the technology and methodology of 3D X-Ray Inspection with Computed Tomography. And 3D X-Ray analysis methods aiming at the structure and process characteristics of SiP were discussed. A case using 3D X-Ray technique analyzing a SiP sample was presented. |
| Sponsorship | IEEE Compon., Packag. Manuf. Technol. Soc. |
| Starting Page | 746 |
| Ending Page | 749 |
| File Size | 1395967 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479904983 |
| DOI | 10.1109/ICEPT.2013.6756573 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | X-ray imaging Three-dimensional displays Computed tomography Inspection Image reconstruction Failure analysis Soldering Computed Tomography System in Package Failure Analysis X-Ray |
| Content Type | Text |
| Resource Type | Article |
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