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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shuang Li Yao Du Lin Qu Kunwar, A. Junhao Sun Jiahui Liu Ning Zhao Mingliang Huang Haitao Ma |
| Copyright Year | 2014 |
| Description | Author affiliation: Sch. of Mater. Sci. & Eng., Dalian Univ. of Technol., Dalian, China (Shuang Li; Yao Du; Lin Qu; Kunwar, A.; Junhao Sun; Jiahui Liu; Ning Zhao; Mingliang Huang; Haitao Ma) |
| Abstract | The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with samples experienced air cooling, the growth of interfacial $Cu_{6}Sn_{5}$ grains could be investigated separately. The morphology of $Cu_{6}Sn_{5}$ grains remained a scallop-type during heating preservations of multiple reflows and they always converted to prism-type after air cooling. The dissolution and precipitation of Cu in liquid Sn with the temperature fluctuations should be responsible to the transformation. Moreover, scalloped $Cu_{6}Sn_{5}$ grains appeared at heating preservation became larger with the increasing number of reflows due to the ripening reaction. Their growth in dimension induced a change in appearance of those prismatic $Cu_{6}Sn_{5}$ grains formed on them. Shorter but larger main facets formed on those prismatic $Cu_{6}Sn_{5}$ grains with the increasing number of reflows. |
| Starting Page | 937 |
| Ending Page | 939 |
| File Size | 409782 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922801 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heating Morphology Tin Cooling Soldering Liquids Joints multiple reflows intermetallic compounds (IMC) morphology growth behavior Cu |
| Content Type | Text |
| Resource Type | Article |
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