NDLI: Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM

Content Provider	IEEE Xplore Digital Library
Author	Yong-min Kwon Kyung-Wook Paik
Copyright Year	2006
Description	Author affiliation: Korea Adv. Inst. of Sci. & Technol., Daejeon (Yong-min Kwon; Kyung-Wook Paik)
Abstract	In this study, electromigration behaviors of Sn3.0Ag0.5Cu solder flip chip using electoless Ni-P UBM were investigated. In anode solder joint, UBM was completely depleted and crack was observed. In the top view of consumed UBM, we could observe several holes on Ni-Sn IMC backfilled by Sn. Anode solder joint was disconnected by the large cavity under this consumed UBM. In the in-situ observation, UBM was preserved its own shape in spite of crack propagation. And resistance was started to increase with fluctuation after crack propagation was ended. To understand the electromigraition behaviors, effect of applied current level and temperature on time to failure was investigated. Calculated activation energy for Black's equation from experimental data was low because of the difference of failure criteria. As a method for enhancing the resistibility to the electromigration failure, effect of UBM thickness was investigated. As results, time to failure of solder joint with 10 mum UBM increased about 5 times than that of solder joint with 5 mum UBM. And UBM consumption rate was reduced due to the low current density at interface in the solder joint with thicker UBM.
Starting Page	1
Ending Page	5
File Size	2936097
Page Count	5
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430603
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Flip chip Gold Soldering Anodes Tin Shape Fluctuations Temperature Difference equations
Content Type	Text
Resource Type	Article

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Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBM

Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints

Effects of UBM thickness on electromigration in Pb-free solder joints

Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

Electromigration in Flip Chip Pb-Free Solder Joints

Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joints

Comparison of electromigration for lead-free solder joints of Cu vs. Ni UBM flip chip structure

Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Failure analysis of sub-50 /spl mu/m lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects

Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM

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