NDLI: Consideration of Mold Compound Cure Shrinkage in Finite Element Modeling

Content Provider	IEEE Xplore Digital Library
Author	Chua Li Yean Mayhuan Lim Yeo, A. Lee, C.
Copyright Year	2006
Description	Author affiliation: Infineon Technol. Asia Pacific Pte Ltd., Singapore (Chua Li Yean; Mayhuan Lim; Yeo, A.; Lee, C.)
Abstract	In this work, the substrate warpage was predicted using the four modeling methods: MeanCTE, InsCTE, CureCTE + MeanCTE and EqvCTE. Both laminate and leadless leadframe substrates were evaluated. The effect of mold compound chemical cure shrinkage on the substrate warpage was also investigated. A laser profilometer was employed to measure the warpage of the laminate and leadless leadframe substrates. Our findings showed that CureCTE + MeanCTE modeling method correlated well with the warpage measurement. This method was employed to further evaluate different mold compounds on the substrate warpage for leadless leadframe substrate. Therefore, the effect of mold compound chemical cure shrinkage is important and has to be implemented appropriately in the model for accurate warpage predictions. It can also be used in package designs and material selections to eliminate the coplanarity issue and achieve an improved assembly process yield in future developments.
Starting Page	1
Ending Page	6
File Size	2399692
Page Count	6
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430568
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Electronic packaging thermal management Assembly Temperature Predictive models Laminates Chemical compounds Electronics packaging Thermal expansion Thermal loading
Content Type	Text
Resource Type	Article

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