NDLI: Investigation of the Effect of PCB Base Materials and Pad Surface Finish on the Thermal Fatigue Life of Lead-free Solder Joints of PBGA and Passive Resistors

Content Provider	IEEE Xplore Digital Library
Author	Fubin Song Lee, S.W.R. Osterman, M. Pecht, M.
Copyright Year	2006
Description	Author affiliation: Hong Kong Univ. of Sci. & Technol., Hong Kong (Fubin Song; Lee, S.W.R.)
Abstract	Legislation that mandates the banning of lead in electronics due to environmental and health concerns has been actively pursued in many countries during the past fifteen years. Although a large number of research studies have been performed and are currently under way in the lead-free solder area, especially on the reliability of lead-free solder joints, abundant data exists predominantly on the short-term reliability (that is, less than five years) of lead-free solder joints under single-loading conditions. Data on long-term reliability is scarce. Lead-free electronics will be deployed in many products that serve markets where long-term reliability is a critical requirement. This paper presents a design-of-experiment reliability study of lead-free solder joints. The printed circuit board (with different base materials: FR4, HT-FR4, and PI) test assemblies include two types of components (PBGA and 2512 resistors), with various terminal metallurgies, several PCB pad finishes (HASL, ImSn, ImAg, ENIG, and OSP), and two solder alloys (SnPb and Sn3.0%Ag0.5%Cu). The test vehicle design, experimental set-up, results, and failure analysis are presented here.
Starting Page	1
Ending Page	7
File Size	3682938
Page Count	7
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430585
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Joining materials Surface finishing Thermal resistance Fatigue Environmentally friendly manufacturing techniques Lead Soldering Resistors Circuit testing Consumer electronics
Content Type	Text
Resource Type	Article

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