NDLI: Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Content Provider	IEEE Xplore Digital Library
Author	Hsiang-Chen Hsu Yu-Chia Hsu Hm-Yu Lee Chang-Lin Yeh Yi-Shao Lai Shen-Li Fu
Copyright Year	2006
Description	Author affiliation: I-Shou Univ., Kaohsiung (Hsiang-Chen Hsu)
Abstract	The objective of this research is to investigate the effects of board-level drop test based on the support excitation scheme incorporated with the submodel technique for stacked-die packages. Three lead-free materials, namely SAC405 (Sn4Ag0.5Cu), SAC387(Sn3.8Ag0.7Cu) and Sn3.5Ag were used to demonstrate the transient dynamic response for solder balls subject to JEDEC pulse-controlled board-level drop test standard JESD22-B110A Condition B[1]. The support excitation scheme was developed and applied to examine the transient dynamic response for it produces no rigid-body motion to the test vehicle and dramatically reduces the computational cost. In order to evaluate the structure of the interested area, a strip model sliced from the full test vehicle is used in this research. In addition, the submodel region is particularly chosen with strip model by performing the cut boundary interpolation. The envelope of equivalent stress for the outermost solder joint off the end of the strip model is plot to show the potential solder failure mode and mechanism. The cut boundary of submodel is verified and the mesh density of submodel is examined. For a refinery mesh of submodel, parametric studies are carried out to study the reliability of the outermost solder joint, and the results are summarized as design rules for the development of stacked-die packages.
Starting Page	1
Ending Page	8
File Size	2112960
Page Count	8
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430622
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Packaging Vehicle dynamics Strips Vehicles Soldering Environmentally friendly manufacturing techniques Lead Materials testing Computational efficiency cut boundary submodeling technique support excitation scheme pulse-controlled board-level drop test stacked-die
Content Type	Text
Resource Type	Article

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