NDLI: Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

Content Provider	IEEE Xplore Digital Library
Author	Shan Gao Jupyo Hong Taehoon Kim Seogmoon Choi Sung Yi
Copyright Year	2006
Description	Author affiliation: Manuf. Eng. R&D Inst., Suwon (Shan Gao; Jupyo Hong; Taehoon Kim; Seogmoon Choi; Sung Yi)
Abstract	In this paper, a numerical study based on the three-dimensional thermo-mechanical finite element method (FEM) has been conducted to analyze the reliability of SAW filter WLP. The 3D FEM model was firstly evaluated based on a benchmark analysis. The validated model is then applied to perform parametric studies on the effects of package geometry, material properties and the processing conditions on the reliability of the package. The stresses and warpages of the package have been analyzed and the critical failure zones have been pointed out. The results show that the CTE of materials play a key role in the reliability of WLP. The maximum stresses and warpages are very sensitive to the CTE of the materials, especially via, the material of which is copper. In addition, the optimal thermo-mechanical properties of materials have been selected to achieve the minimum thermal stress during wafer bonding process based on the parametric studies.
Starting Page	1
Ending Page	4
File Size	1873106
Page Count	4
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430583
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface acoustic waves Wafer scale integration Packaging Acoustic waves Thermal stresses Thermomechanical processes Semiconductor device modeling Parametric study Materials reliability Filters
Content Type	Text
Resource Type	Article

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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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