NDLI: Comparison of electromigration for lead-free solder joints of Cu vs. Ni UBM flip chip structure

Content Provider	IEEE Xplore Digital Library
Author	Rungyusiri, V. Sa-ngiamsak, C. Harnsoongnoen, S. Intarakul, P.
Copyright Year	2009
Description	Author affiliation: Department of Electrical Engineering, Faculty of Engineering, Khon Kaen University, Thailand 40002 (Rungyusiri, V.; Sa-ngiamsak, C.; Harnsoongnoen, S.) \|\| Department of Radiology, Faculty of Medicine, Khon Kaen University, Thailand 40002 (Intarakul, P.)
Abstract	Flip chip solder joints made with Cu and Ni underbump metallurgy (UBM) on the chip under current stressing were studied. The effects of material and various thicknesses (5, 10, 15, and 20 µm) of UBM on reliability were investigated. The solder material used was lead-free (Sn4.0Ag0.5Cu). Time to failure of both cases (Cu and Ni UBMs) was forecasted through the physical damage occurring at the bump under current stressing by using two-dimensional Finite Element Method (FEM). The simulation results conclude that thicker UBM can enhance electromigration reliability. Moreover, the comparison of the time to failure between Cu UBM structure with that of Ni UBM structure indicates that the time to failure of the flip chip solder joint with Cu UBM structure is approximately 5% longer than the case of Ni UBM structure due to the lowering current crowding effect at Cu UBM in the solder joint which is clearly shown in the simulations.
Starting Page	469
Ending Page	472
File Size	332881
Page Count	4
File Format	PDF
ISBN	9781424433872
DOI	10.1109/ECTICON.2009.5137050
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-06
Publisher Place	Thailand
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Temperature Environmentally friendly manufacturing techniques Failure analysis Lead Packaging Flip chip Soldering Current density Thermal stresses
Content Type	Text
Resource Type	Article

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