NDLI: A Comprehensive Study in Thermal Dissipation Assessment of Hard Disk Drive Component

Content Provider	IEEE Xplore Digital Library
Author	Mingzong Wang Jeng Yung Lai Yu-Po Wang Hsiao, C.S.
Copyright Year	2006
Description	Author affiliation: Siliconware Precision Ind. Co., Ltd., Taichung (Mingzong Wang; Jeng Yung Lai; Yu-Po Wang; Hsiao, C.S.)
Abstract	With the demand increases in data storage capacity and high-speed data transfer rate, the controller components of hard disk drive (HDD) need more power to serve the higher level of electrical function performance. Therefore, an optimal thermal design for HDD components to ensure HDD operating under safe temperature environment becomes very important for suppliers to successfully bring HDD product into market. In this study, a HDD component was attached onto a metal block that is a part of HDD body implemented to enhance thermal dissipation. Several thermal designs from component to HDD module will be addressed to achieve the chips running below industry specification of 125degC. Firstly, two different metal block designs were evaluated with experimental analyses. Next, different screw material that uses to fasten PCB board and HDD and different thermal pad thickness that between HDD component and metal block are evaluated. Finally, different test section, ambient temperature and power consumption effect was also evaluated. After experimental analyses finished, the simulation model with a commercial finite differential analysis (FDA) program, Flotherm, was conducted to find the best thermal solution for three different HDD component structures including plastic ball grid array (PBGA), BGA with exposed drop-in heat spreader and thin fine pitch BGA. The conclusion of this study indicates the thin fine pitch BGA package with high thermal conductivity molding compound was the optimal installation for greatest thermal benefit for HDD component.
Starting Page	1
Ending Page	5
File Size	2218482
Page Count	5
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430612
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Hard disks Thermal conductivity Temperature Memory Fasteners Inorganic materials Testing Energy consumption Analytical models Plastics
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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