NDLI: Influence of Material Combination on Package Stress and Verification of Numerical Model

Content Provider	IEEE Xplore Digital Library
Author	Krishnan, S. Aripin, A. Muhamad, M.R.
Copyright Year	2006
Description	Author affiliation: Package Innovation & Dev. Center, Seremban (Krishnan, S.; Aripin, A.)
Abstract	This paper demonstrates the experimental approach of using various packaging material combination and their effect on package stress at 260degC IR reflow condition. The study is extended into validating the results with the use of simulation and modeling tool using finite element analysis (FEA). Large leadless package (7.0 times 7.0 mm) was selected for this study. Samples were built with different material combination of epoxy based die attach and mold compound materials and subjected to specially designed stress tests. Scanning Acoustic Tomography (SAT) was used to detect the presence of delamination after the stress cycle. Mechanical properties of these materials are fed into FEA tool and simulation was done to predict package stress under the designed special testing condition. A correlation between experimental and FEA simulation result was established. The numerical and experimental analyses of the specially designed test confirmed the accuracy of the FEA prediction, which could be convenient for future virtual prototyping analyses. This will help to reduce the experimental and test time for future package design and development.
Starting Page	1
Ending Page	8
File Size	3637999
Page Count	8
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430574
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Stress Numerical models Acoustic testing Materials testing Analytical models Semiconductor device modeling Finite element methods Microassembly Tomography QFN Delamination Finite element analysis thermal stress
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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