NDLI: Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

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Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

Content Provider	IEEE Xplore Digital Library
Author	Mingyu Li Hongjun Ji Chunqing Wang
Copyright Year	2006
Description	Author affiliation: Harbin Inst. of Technol., Shenzhen (Mingyu Li)
Abstract	Considering two kinds of the most widely used wire bonding pads of the COB and BGA packaging styles, the characters of the bond interfaces in Al-Ni and Al-Au systems were compared after high temperature storage test through SEM observation. It was found that, according to the appearance, the Al-Au bond aged at 250degC in air for more than 40 days was expanded badly, and surface cracks were severe, but the Al-Ni bond changed little. At bond interface, $AuAl_{2}$ IMC was formed in Al-Au system, furthermore, many inner cracks initial the boundary of the wire and the IMC connected with the cracks in the wire, however, there was no such thick IMC formed in Al-Ni system. The causation was analyzed based on the metallurgical theory. Experimentally, the Al-Ni system was more reliable than the Al-Au system.
Starting Page	1
Ending Page	4
File Size	2326585
Page Count	4
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430642
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Wire Gold Temperature Nickel Copper Packaging System testing Aging Substrates
Content Type	Text
Resource Type	Article

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