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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kai Zhang Haibo Fan Yuen, M.M.F. |
| Copyright Year | 2006 |
| Description | Author affiliation: Hong Kong Univ. of Sci. & Technol., Kowloon (Kai Zhang; Haibo Fan; Yuen, M.M.F.) |
| Abstract | Carbon nanotubes (CNT) are an attractive candidate to form thermal interface material (TIM) and improve the thermal management performance of microelectronic packages. In this paper, thermal performance of CNT-array-TIM was predicted by nonequilibrium molecular dynamics simulation. The ab initio forcefield COMPASS (Condensed-phase Optimized Molecular Potentials for Atomistic Simulation Studies) was adopted to model interatomic chemical bonding and non-bonding potential energy. A constant heat flux was imposed on the system and the resulting temperature gradient was calculated to obtain the thermal conductivity. The effects of the diameter of CNT and the temperature on the thermal conductivity of CNT-array-TIM were studied. It was demonstrated that significantly drop of thermal conductivity of CNT-array-TIM occured with the temperature increases up to room temperature. However, it will not reduce much with the temperature further increase. It was also found that the thermal conductivity of CNT-array-TIM increased with the increased diameter of the armchair CNT. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 1781017 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424408337 |
| DOI | 10.1109/EMAP.2006.4430586 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-12-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity Temperature Thermal management Carbon nanotubes Organic materials Microelectronics Packaging Predictive models Chemicals Bonding forces |
| Content Type | Text |
| Resource Type | Article |
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