NDLI: System-in-Package (SiP) Design: Issues, Approaches and Solutions

Content Provider	IEEE Xplore Digital Library
Author	Leung, L.L.W. Sham, M.L. Ma, W. Chen, Y.C. Lin, J.R. Chung, T.
Copyright Year	2006
Description	Author affiliation: Hong Kong Appl. Sci. & Technol. Res. Inst. (ASTRI), Hong Kong (Leung, L.L.W.; Sham, M.L.; Ma, W.; Chen, Y.C.; Lin, J.R.; Chung, T.)
Abstract	With an increasing demand of low-cost, small-size, high- performance and multi-function portable and wireless applications, System-in-Package (SiP), which provides various advantages including shorter time-to-market, better performance and lower cost and allows a combination of the multiple semiconductor technologies, such as silicon (Si), silicon germanium (SiGe), gallium arsenide (GaAs), has aroused a lot of interest from both industries and academia. With the emergence and breakthrough of certain critical assembly and substrate technologies, SiP technologies become promising solutions for today's short life-cycle consumer electronic products. However, in order to timely deliver a first-pass SiP product and achieve the above mentioned advantages offered by SiP: small-size, low-cost and high-performance, careful and concurrent design in both electrical and thermo-mechanical aspects through skillful modeling, accurate and efficient simulation is needed. Tradeoff among multi-disciplinary performance constraints, manufacturability and cost is a must as well. In this paper, we address the issues, technical challenges, approaches and solutions including inter-disciplinary performance constraints, signal integrity, testability, etc., of designing different types of low-cost and high-yield SiP modules: digital, analog and mixed-signal. Examples covering techniques, methodologies and technologies utilized in designing different types of SiP modules, including electromagnetic (EM) simulation for signal integrity analysis, thermo-mechanical simulation for high-power devices and different substrate technologies will be provided.
Starting Page	1
Ending Page	5
File Size	2799193
Page Count	5
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430662
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Silicon germanium Germanium silicon alloys Gallium arsenide Substrates Thermomechanical processes Signal design Analytical models Time to market Assembly
Content Type	Text
Resource Type	Article

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