NDLI: Thermal measurement of cerebrospinal fluid flow rate in hydrocephalus shunt

Content Provider	IEEE Xplore Digital Library
Author	Rajasekaran, S. Hongwei Qu Zakalik, K.
Copyright Year	2015
Description	Author affiliation: Dept. of Pediatric Neurosurg., William Beaumont Hosp., Beaumont, MI, USA (Zakalik, K.) \|\| Dept. of Electr. & Comput. Eng., Oakland Univ., Rochester, MI, USA (Rajasekaran, S.; Hongwei Qu)
Abstract	This paper presents a novel mechanism for convenient in vitro measurement of cerebrospinal fluid flow rate in hydrocephalus shunts. Thermal time of flight method has been employed in the measurements conducted on a modified shunt system covered with artificial skin. The shunt tube is proposed to include bio-compatible materials such as titanium for better thermal responses. To facilitate clinical measurements by neurosurgeons, a dry, semiconductor thermoelectric cooling device has been designed to initiate the thermal transfer while maintaining a safe operating temperature and clean thermal excitation. Velocity thus flow rate of the cerebrospinal fluid has been derived by decoupling the thermal transfer in the measured differential time at two measurement spots of the titanium elements. Device design was based on comprehensive system simulation using finite element analyses on the fluidic and thermal behaviors of the shunt system. Microcontroller and proper control schemes have been used for desired thermal excitation and temperature registrations. The mechanism has been validated in measurements conducted on a laboratory setup consisting of the modified shunt, covered by commercial synthetic human skins in an environment similar to human physiology. The measurement results have demonstrated good agreements with the simulation results in the clinically practical flow rates ranging from 0.5 mm/sec to 1.0 mm/sec.
Sponsorship	IEEE
Starting Page	1
Ending Page	4
File Size	870784
Page Count	4
File Format	PDF
e-ISBN	9781479982035
DOI	10.1109/ICSENS.2015.7370415
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-11-01
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature measurement Electron tubes Thermal resistance Skin Fluid flow measurement Titanium Semiconductor device measurement Thermo-electric cooling (TEC) Cerebrospinal fluid (CSF) CSF shunt Flow rate measurement Thermal time of flight (TOF)
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in