NDLI: Micromachined silicon hemispherical resonators with self-aligned spherical capacitive electrodes

Content Provider	IEEE Xplore Digital Library
Author	Xuye Zhuang Xinlong Wang Lei Yu Pinghua Li Bo Chen Qunying Guo Shuwen Guo
Copyright Year	2015
Description	Author affiliation: East China Inst. of Photo-Electron. IC, Bengbu, China (Xuye Zhuang; Xinlong Wang; Lei Yu; Pinghua Li; Bo Chen; Qunying Guo) \|\| Sch. of Electron. Inf., Soochow Univ., Soochow, China (Shuwen Guo)
Abstract	A micromachined silicon hemispherical resonator with self-aligned silicon spherical capacitive electrodes is developed for the first time. Spherical electrodes, owning the same curvature of the resonator shell, surround the shell and extend into the cave deeply (160μm). The gap between the electrodes and shell is made by a sacrificial layer and a uniform and small (1.5μm) gap is obtained, which enables a large drive and sense capacitance of the resonator. Spherical electrodes are integrated as a part of the resonators fabrication process, and no extra assembly process is needed, ensuring the symmetry of the resonator. A resonator with 790μm diameter and thickness of 1.5μm has been demonstrated by the self-aligned fabrication process. The radial deviation of the hemispherical shell is less than 1.22μm for the ~500 radius shell (0.24%).
Sponsorship	IEEE
Starting Page	1
Ending Page	4
File Size	1500326
Page Count	4
File Format	PDF
e-ISBN	9781479982035
DOI	10.1109/ICSENS.2015.7370238
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-11-01
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrodes Silicon Fabrication Glass Metals Micromechanical devices Capacitance micromachined hemispherical resonators spherical electrodes self-alighed
Content Type	Text
Resource Type	Article

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