NDLI: TAPE: Thermal-aware agent-based power econom multi/many-core architectures

Content Provider	IEEE Xplore Digital Library
Author	Ebi, T. Faruque, M. Henkel, J.
Copyright Year	2009
Description	Author affiliation: Dept. of Embedded Sytems, Univ. of Karlsruhe, Karlsruhe, Germany (Ebi, T.; Faruque, M.; Henkel, J.)
Abstract	A growing challenge in embedded system design is coping with increasing power densities resulting from packing more and more transistors onto a small die area, which in turn transform into thermal hotspots. In the current late silicon era silicon structures have become more susceptible to transient faults and aging effects resulting from these thermal hotspots. In this paper we present an agent-based power distribution approach (TAPE) which aims to balance the power consumption of a multi/many-core architecture in a pro-active manner. By further taking the system's thermal state into consideration when distributing the power throughout the chip, TAPE is able to noticeably reduce the peak temperature. In our simulation we provide a fair comparison with the state-of-the-art approaches HRTM and PDTM using the MiBench benchmark suite. When running multiple applications simultaneously on a multi/many-core architecture, we are able to achieve an 11.23% decrease in peak temperature compared to the approach that uses no thermal management. At the same time we reduce the execution time (i.e. we increase the performance of the applications) by 44.2% and reduce the energy consumption by 44.4% compared to PDTM. We also show that our approach exhibits higher scalability, requiring 11.9 times less communication overhead in an architecture with 96 cores compared to the state-of-the-art approaches.
Starting Page	302
Ending Page	309
File Size	1102865
Page Count	8
File Format	PDF
ISBN	9781605588001
ISSN	10923152
DOI	10.1145/1687399.1687457
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-11-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Thermal management Runtime Energy consumption Temperature Scalability Embedded system Silicon Power distribution Permission Heat transfer Pro-Active Algorithm Dynamic Thermal Management Agent-Based Systems Multi-Core Architectures
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in