NDLI: Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs

Content Provider	IEEE Xplore Digital Library
Author	Young-Joon Lee Goel, R. Sung Kyu Lim
Copyright Year	2009
Description	Author affiliation: School of Electrical and Computer Engineering, Georgia Institute of Technology, 777 Atlantic Drive NW, Atlanta, Georgia 30332, U.S.A. (Young-Joon Lee; Goel, R.; Sung Kyu Lim)
Abstract	Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-vias (T-TSVs) and micro-fluidic channel (MFC) based liquid cooling. In case of power delivery, a highly complex power distribution network is required to deliver currents reliably to all parts of the 3D stacked IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. This is because the signal, power, and thermal interconnects are all competing for routing space. In this paper, we present a co-optimization methodology for the signal, power, and thermal interconnects for 3D stacked ICs based on design of experiments (DOE) and response surface method (RSM). The goal is to improve performance, thermal, noise, and congestion metrics with our holistic approach. We also provide in-depth comparison between T-TSV and MFC based cooling method and discuss how to employ DOE and RSM to best co-optimize the multi-functional interconnects simultaneously. Categories and Subject Descriptors B.7.2 [Hardware]: Integrated Circuits-Design Aids General Terms Design, Reliability
Starting Page	645
Ending Page	651
File Size	1946917
Page Count	7
File Format	PDF
ISBN	9781605588001
ISSN	10923152
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-11-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Thermal management Integrated circuit interconnections Integrated circuit noise Signal design Semiconductor device noise US Department of Energy Liquid cooling Power supplies Noise level Routing design of experiments 3D stacked IC through-silicon-via micro-fluidic channel
Content Type	Text
Resource Type	Article
Subject	Computer Graphics and Computer-Aided Design Computer Science Applications Software

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