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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lei Qiao Yong Zuo Limin Ma Yutian Shu Fu Guo |
| Copyright Year | 2014 |
| Description | Author affiliation: Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China (Lei Qiao; Yong Zuo; Limin Ma; Yutian Shu; Fu Guo) |
| Abstract | The reliability issues such as creep, electromigration (EM), and thermal fatigue of solder joints in real service condition have gained much attention due to the rapid development of electronic devices towards multi-function, miniaturizing and portable tendency. There are many studies focusing on microstructure changes of solder joints under the single condition of creep, EM, or thermal fatigue. However, few studies focus on the coupling effect(s) of the above mentioned impact factors during the failure process of a solder joint. In this study, Sn-0.3Ag-0.7Cu which has much lower cost than Sn-3.0Ag-0.5Cu under the coupling stressing of EM and creep were investigated. The in-situ microstructure and resistance of the solder joints were observed and measured during the failure process. The results indicated that the lifetime, the fracture location, and the fracture mode of solder joint were significantly changed by the coupling effect(s) of creep and EM. |
| Starting Page | 902 |
| Ending Page | 906 |
| File Size | 1637819 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922794 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Current density Creep Resistance Microstructure Couplings Cathodes failure mechanism solder joint current density creep |
| Content Type | Text |
| Resource Type | Article |
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