NDLI: High power RF amplifiers module assembly — Issues to consider, design, materials and process

Content Provider	IEEE Xplore Digital Library
Author	Nguty, T. An Xiao Thoonen, H.
Copyright Year	2014
Description	Author affiliation: NXP Semicond., Nijmegen, Netherlands (Nguty, T.; An Xiao; Thoonen, H.)
Abstract	RF transistors can be found in several present day electronics including mobile radio and telecommunication applications, TV & radio broadcast, avionics, radar and defense communications as well as industrial, scientific, medical (ISM) and broadcast applications. The increasing demands for data anywhere/anytime (mobile internet) requires increased deployment of wireless communication infrastructure. This has pushed upwards across the supply chain (suppliers and customers alike). At the core are RF power amplifiers (PA) with a very costly design, hence important to get it right as rework may not be possible. The assembly of RF power transistors in PA modules is the back-bone of these applications. Such modules are usually generating high power (> 100 watts) with different package outlines and lead configuration. The high power demands excellent thermal management, else product performance and lifetime (reliability) are compromised. As a consequence, the transistors are often packaged in “chunky” S OT outlines, with a cerami c/plastic body and a metal flange. Packaging such RF power modules (or PA) has historically been achieved with bolt down devices, where only the leads of the components were soldered (more akin to manual assembly operations). A thermal compound was used underneath the transistor. High volume assembly is a basic capability (with automation a necessity) to meet industry demand. There are a variety of issues to consider module assembly since there are strong interplay between design, materials and process in order to achieve the desired performance (electrical, thermal, mechanical, and reliability). Due to thermal management requirement, the transistors are normally soldered directly onto the pallet (laminate bonded onto a heat sink) with the leads and SMDs on to the laminate on the pallet. Base on the SOT outline (i.e. gull wing), a cavity or pedestal is required in the pallet with a cut-out in the laminate. Each PA module will be different in i.e. size, weight, materials, number of transistors, board construction with no two modules the same. With such spectra of possibilities in the module design and permutations on assembly processes, the paper outlines and addresses the key issues to consider and approach to achieve robust PA modules assembly. It includes but not limited to substrates, solders, heat sinks, plating, board design and reflow soldering (assembly process flow). Key to achieving the robust assembly process is an iterative approach with feedback at each step in the process including a modeled reflow profiling. In addition, a novel use of Rth (thermal impedance) in combination to acoustic microscopy / x-rays to assess the quality of the soldered interface is presented. The solder volume is key to accommodate manufacturing tolerances and solder joint reliability. Additionally, the issues presented constitute a “toll-box” for PA module assembly, including microwave pallet modules with matched input/output impedance.
Starting Page	1375
Ending Page	1380
File Size	662562
Page Count	6
File Format	PDF
ISBN	9781479947072
DOI	10.1109/ICEPT.2014.6922907
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-08-12
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Cavity resonators Laminates Heat sinks Transistors Radio frequency pallets Packaging RF power amplifier microwave pallets soldering
Content Type	Text
Resource Type	Article

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