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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lingjuan Tian Yuanfu Zhao Quanbin Yao Yusheng Cao Binhao Lian |
| Copyright Year | 2014 |
| Description | Author affiliation: Beijing MXTronics Corp., Beijing, China (Lingjuan Tian; Yuanfu Zhao; Quanbin Yao; Yusheng Cao; Binhao Lian) |
| Abstract | Flip chip technology has attracted considerable attention due to its advantages in providing higher I/O interconnects and better electrical and thermal performances. Solder joint not only offers electrical connection between the silicon chip and the substrate, but also offers mechanical connection in electronics. The reliability of solder joint has been become an increasingly extrusive problem. Among the study of flip-chip solder joints reliability, the interfacial reaction between solder and UBM is a fundamental and crucial subject. Sn-Pb solder is still commonly utilized in many high reliability applications due to its excellent physical, mechanical and metallurgical performances. And this paper mainly introduces the growth and evolution of the IMC during solid-state annealing of Sn-Pb solder joints. This study showed that Ti-Cu-Ni UBM has a better performance compared with Ti-Cu-Cu UBM. And we also found that the tin content in the solders has a significant effect on the formation of the intermetallic compounds during interfacial reaction. |
| Starting Page | 847 |
| Ending Page | 849 |
| File Size | 403794 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922780 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Annealing Reliability Nickel Flip-chip devices Tin Compounds Flip chip Solder joint |
| Content Type | Text |
| Resource Type | Article |
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