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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Donghua Yang Guoshuai Yang Jian Cai Qian Wang Yang Hu Jingwei Li Liangliang Li |
| Copyright Year | 2014 |
| Description | Author affiliation: Key Lab. of Adv. Mater. (MOE), Tsinghua Univ., Beijing, China (Donghua Yang; Guoshuai Yang; Liangliang Li) || Inst. of Microelectron., Tsinghua Univ., Beijing, China (Jian Cai; Qian Wang; Yang Hu; Jingwei Li) |
| Abstract | In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition of Co-P finishes and IMCs was determined by energy dispersive spectroscopy. The shear strength of Sn-Pb/Cu and Sn-Pb/Co-P solder joints was obtained by ball shear testing. The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish. The shear strength of Sn-Pb/Co-4%P solder joints was slightly lower than that of Sn-Pb/Cu joints after thermal cycling, whereas the Sn-Pb/Co-8%P solder joints exhibited the highest shear strength. The fracture mode of all three kinds of joints was ductile mode. The experimental data showed that Co-8%P could be a good surface finish used in BGA packages. |
| Starting Page | 239 |
| Ending Page | 242 |
| File Size | 1023404 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922645 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Joints Surface morphology Surface cracks Surface finishing Electronics packaging Substrates thermal cycling Sn-Pb solder joints Co-P surface finish shear strength |
| Content Type | Text |
| Resource Type | Article |
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