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Content Provider | IEEE Xplore Digital Library |
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Author | Jia Zhao Yan Liu Hongyu Tang Leung, S.Y.Y. Yuan, C.C.A. Zhang, G.Q. |
Copyright Year | 2014 |
Description | Author affiliation: State Key Lab. of Solid-State Lighting, Changzhou, China (Jia Zhao; Yan Liu; Hongyu Tang; Leung, S.Y.Y.) || State Key Lab. of Solid-State Lighting, Beijing, China (Yuan, C.C.A.) || Delft Inst. of Microsyst. & Nanoelectron. (Dimes), Delft Univ. of Technol., Delft, Netherlands (Zhang, G.Q.) |
Abstract | A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element analysis was performed to optimize the thermal design by varying metal line routing on the flexible substrate, and the glass tube structure. The optimal result shows that the junction temperatures of the LED inside the lamp is about 52°C driven under nominal current. The simulation result is comparable with the experimental measurement. In addition, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. The details of the design and the optimization strategy is discussed. |
Starting Page | 1202 |
Ending Page | 1207 |
File Size | 769541 |
Page Count | 6 |
File Format | |
ISBN | 9781479947072 |
DOI | 10.1109/ICEPT.2014.6922859 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2014-08-12 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Glass Light emitting diodes Temperature measurement Electron tubes Heating Finite element analysis Substrates strain based fatigue life prediction LED heat dissipation flexible substrate |
Content Type | Text |
Resource Type | Article |
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