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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Liang Huang Gang Li Pengli Zhu Rong Sun Daoqiang Lu Chingping Wong |
| Copyright Year | 2014 |
| Description | Author affiliation: Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Hong Kong, China (Chingping Wong) || Shenzhen Inst. of Adv. Technol., Shenzhen, China (Liang Huang; Gang Li; Pengli Zhu; Rong Sun; Daoqiang Lu) |
| Abstract | Raspberry-like $SiO_{2}$ $(R-SiO_{2})$ nanoparticles were prepared by electrostatic self-assembly of two different sizes $SiO_{2}$ nanoparticles under the help of polyelectrolytes, which would be removed by further calcination. The $R-SiO_{2}/epoxy$ composites were fabricated then by a solvent-free curing process. The morphology of $R-SiO_{2}$ and fracture morphology of their epoxy composites were observed by scanning electron microscopic (SEM). Thermo-mechanical properties including storage modulus, glass transition temperature $(T_{g})$ and coefficient of thermal expansion (CTE) are critical properties for $SiO_{2}/epoxy$ composites. To observe these parameters, dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA) were used, respectively. The results showed that the $R-SiO_{2}$ particles could be used as effective fillers on increasing $T_{g}$ and decreasing CTE of the epoxy composites. |
| Starting Page | 262 |
| Ending Page | 265 |
| File Size | 802515 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922650 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nanoparticles Polymers Surface morphology Surface treatment Silicon compounds Thermomechanical processes Morphology coefficient of thermal expansion SiO |
| Content Type | Text |
| Resource Type | Article |
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