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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jinlong Zhang Luqiao Yin Peng Song Yang Bai Jianhua Zhang |
| Copyright Year | 2014 |
| Description | Author affiliation: Sch. of Mechatron. & Autom., Shanghai Univ., Shanghai, China (Jinlong Zhang; Luqiao Yin; Peng Song; Jianhua Zhang) || Key Labs. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China (Yang Bai) |
| Abstract | The optical performance and reliability of High power light emitting diode (HP-LED) devices can be affected by the junction temperature, while thermal resistance is one of the main factors which influence the p-n junction temperature, especially for the thermal spreading resistance. So, Thermal analysis was conducted by differential structure functions combining with finite element analysis and calculation of thermal spreading resistance of HP-LED devices. The results show that thermal spreading resistance plays an important role on total thermal resistance of LED devices. The thermal spreading resistance shows a declined and then increased trend with the increase of substrate thickness; the contact area between the heating source and substrate is the main factor which influences thermal spreading resistance; It is beneficial to decrease the thermal spreading resistance when contact area ratio be increased. Thermal-convection resistance becomes the main factor that influences total thermal resistance of HP-LED devices with the changing of substrate bottom area, while the influence of thermal spreading resistance is weak. The eccentric distance between chip and substrate plays a distinct impact on thermal spreading resistance and junction temperature. The results of finite element simulation are in good agreement with calculation of thermal spreading resistance. |
| Starting Page | 806 |
| Ending Page | 810 |
| File Size | 612792 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922771 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal resistance Electronic packaging thermal management Substrates Light emitting diodes Thermal factors Resistance heating eccentric distance HP-LED thermal spreading resistance substrate thickness contact area ratio |
| Content Type | Text |
| Resource Type | Article |
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