NDLI: Localization of critical frequency for simulation of high-speed interconnects

Content Provider	IEEE Xplore Digital Library
Author	Wen Ding Feng Liu Sheng Liu Gaofeng Wang
Copyright Year	2014
Description	Author affiliation: Sch. of Electron. Inf., Hangzhou Dianzi Univ., Hangzhou, China (Gaofeng Wang) \|\| Sch. of Power & Mech. Eng., Wuhan Univ., Wuhan, China (Wen Ding; Feng Liu; Sheng Liu)
Abstract	The complexity of electromagnetic simulation of high-speed interconnects drastically rises as frequency moves upwards. Although full wave simulation is with high precision and capable of electromagnetic simulation through dc to hundreds of gigahertz, for consideration of high efficiency the quasi-static-electromagnetic-field-based parameters extraction combined with the circuit simulation still remains the mainstream methodology for large scale integrated circuits and complex packages simulation in practice. With quasi-static simulator, the resistance, inductance, capacitance, and conductance (RLCG) parameters of interconnects are first extracted using the partial element equivalent circuit (PEEC) model or the transmission line model, afterward these extracted parameters are put into the distributed equivalent circuit, and the final simulation result is obtained by performing circuit simulation. In this paper a signal wire differential pair which is widely adopted for high-speed interconnection in RFIC is modeled and simulated from dc to 30 GHz by quasi-static simulator and full wave simulator, respectively. Comparison of the simulation results shows that although quasi-static simulator is not able to simulate some high frequency phenomena such as radiation and eddy current in the conductive substrate, under circumstance of perfectly screening and using low loss substrate (e.g. with loss tangent no more than 0.02) the conventional parameters extraction based on PEEC model and quasi-static approximation performs well up to tens of gigahertz with acceptable accuracy.
Starting Page	1512
Ending Page	1515
File Size	205893
Page Count	4
File Format	PDF
ISBN	9781479947072
DOI	10.1109/ICEPT.2014.6922941
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-08-12
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Capacitance Inductance Simulation Integrated circuit interconnections Wires Resistance Full Wave Simulation High-Speed Inerconnect Electromagnetic Field Partial Element Equivalent Circuit
Content Type	Text
Resource Type	Article

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