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Content Provider | IEEE Xplore Digital Library |
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Author | Shui-Bao Liang Chang-Bo Ke Wen-Jing Ma Min-Bo Zhou Xin-Ping Zhang |
Copyright Year | 2014 |
Description | Author affiliation: Lab. of Smart Mater. & Electron. Packaging (SMEP), South China Univ. of Technol., Guangzhou, China (Shui-Bao Liang; Chang-Bo Ke; Wen-Jing Ma; Min-Bo Zhou; Xin-Ping Zhang) |
Abstract | During the soldering process, Kirkendall voids may form at the $Cu/Cu_{3}Sn$ interface and in $Cu_{3}Sn$ compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance and reliability of solder interconnects. In this paper, a phase field crystal model of a substitutional binary is developed and applied to simulate the formation and growth of Kirkendall voids in the $Cu/Cu_{3}Sn$ interface in the atomic scale. The simulation results show that the formation and growth of Kirkendall voids includes four stages: incubation, nucleation, growth and healing stages. With increasing the grain boundary angle, more Kirkendall voids may form and the average diameter of Kirkendall voids decreases due to the competitive growth between different Kirkendall voids. |
Starting Page | 641 |
Ending Page | 645 |
File Size | 750422 |
Page Count | 5 |
File Format | |
ISBN | 9781479947072 |
DOI | 10.1109/ICEPT.2014.6922737 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2014-08-12 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Soldering Grain boundaries Tin Liquids Reliability Electronics packaging Phase field crystal simulation Kirkendall voids Microscale lead-free solder interconnect Soldering reaction |
Content Type | Text |
Resource Type | Article |
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