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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shafiq, I. Chan, Y.C. |
| Copyright Year | 2011 |
| Description | Author affiliation: Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong SAR (Shafiq, I.; Chan, Y.C.) |
| Abstract | In this study, doped-Sn58Bi solders were prepared by mechanically dispersing Ag nano particles additive in Sn-58Bi solders. The interfacial morphologies of the plain solder and doped Sn-58Bi solders under a direct current (DC) of 2.5 A at 75°C temperature with Cu pads and Au/Ni/Cu on daisy chain type ball grid array (BGA) substrates were characterized. Unlike the plain solder, there is no obvious accumulation of Bi-rich IMC or Sn rich IMC extrusions on the anode side or cathode side, respectively. The Cu-Sn IMCs on the Cu substrate and Ni-Sn IMCs on the Au/Ni substrates were formed near the cathode interface after the first-reflow induced current crowding near the junction. Cluster like Ag-Sn IMCs in the solder matrix prevented the migration of atoms under current stressing and improved the electro-migration resistance. In addition, fracture occurs at the IMC interfacial region during shear testing with a ductile fracture mode. In the solder ball region β-Sn matrix of Sn-58Bi solder joints with a refined microstructure and inter-metallic compound particles Ag were observed, which resulted in an increase in the shear strength, due to a second phase dispersion strengthening mechanism. |
| Starting Page | 374 |
| Ending Page | 379 |
| File Size | 1252262 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781457712296 |
| e-ISBN | 9781457712326 |
| DOI | 10.1109/ICQR2MSE.2011.5976634 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-06-17 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nano doping Gold Electro-migration Shear strength Nickel Copper Microstructure Soldering Junctions Substrates Cathodes Flip Chip solder joints |
| Content Type | Text |
| Resource Type | Article |
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