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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xiaoyan Niu Zhanbiao Zhang Guixiang Wang Xuefeng Shu |
| Copyright Year | 2014 |
| Description | Author affiliation: Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan, China (Xuefeng Shu) || Coll. of Civil Eng., Hebei Univ., Baoding, China (Xiaoyan Niu; Zhanbiao Zhang; Guixiang Wang) |
| Abstract | Based on the JEDEC standard, the three-dimensional finite element model of board level VFBGA package components was established, and the reliability of low silver lead-free solder Sn0.3Ag0.7Cu under drop impact was observed. The results show that, the mechanical impact and bending of PCB caused by mechanical shock are the main reasons which induce the drop failure of solder joint in the drop impact conditions; it is not neglect to consider the strain rate and thermal effect of solders in numerical simulation; as for low silver lead-free solder Sn0.3Ag0.7Cu, the distribution of the maximum stress on the joints was observed in the interface of the solder joints at low temperature; compared with high silver solder, the stress around test plate side silver solder is greater than that around the side of the package, while high silver solder just the opposite; and the maximum stress of low silver lead-free solder is much lower than that of the high silver solder, which shows better resistance to drop. |
| Starting Page | 762 |
| Ending Page | 765 |
| File Size | 528023 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922761 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Stress Silver Lead Finite element analysis Reliability Strain drop impact low silver lead-free solder temperature effect finite element |
| Content Type | Text |
| Resource Type | Article |
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