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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sun Ling Wang Xuemin Sun Haiyan Wang Shenglong Yang Lingling |
| Copyright Year | 2014 |
| Description | Author affiliation: Jiangsu Key Lab. of ASIC Design, Nantong Univ., Nantong, China (Sun Ling; Wang Xuemin; Sun Haiyan; Wang Shenglong; Yang Lingling) |
| Abstract | In this paper, a 3D model of an existing IC socket used for a QFP packaged chip with 48 pins on a 0.5mm pitch is built in Ansys's three-dimensional electromagnetic simulation software HFSS. Three different types of pin are simulated and their signal transmission characteristics are analyzed by comparing the simulated S-parameters. On the basis of this socket, a new socket physical model for QFP-48 is proposed with the change of pin's structure. The simulated S-parameters of the same pins show that the modified socket model has better signal transmission performance and can achieve higher operating frequency. Furthermore, the relationship between this new socket's relative permittivity and its signal transmission characteristics is analyzed. |
| Starting Page | 547 |
| Ending Page | 550 |
| File Size | 635433 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479947072 |
| DOI | 10.1109/ICEPT.2014.6922715 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-12 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Sockets Pins Permittivity Insertion loss Integrated circuit modeling Solid modeling Quad Flat Package socket modeling signal integrity electromagnetic simulation |
| Content Type | Text |
| Resource Type | Article |
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