NDLI: Development of ultra-thin one-side contacted GaAs solar cells for mechanically stacked multi-junction solar cells

Content Provider	IEEE Xplore Digital Library
Author	Lu Zhao Flamand, G. Mols, Y. van der Heide, J. Poortmans, J.
Copyright Year	2009
Description	Author affiliation: IMEC vzw, Kapeldreef 75, B-3001 Leuven, Belgium (Flamand, G.; Mols, Y.; van der Heide, J.; Poortmans, J.) \|\| Department of Electrical Engineering, Katholieke Universiteit Leuven, B-3001, Belgium (Lu Zhao)
Abstract	The approach of mechanically stacking cells allows more freedom on cell design and material choice for multi-junction solar cells. Since there is no requirement on current matching, mechanically stacked cells have a high performance potential, and are not sensitive to spectrum variations. Recently at IMEC, we have demonstrated ultra-thin substrate-free GaAs solar cells, which will be used as a component cell in a mechanically stacked multi-junction configuration. The GaAs cell substrate is completely removed, to avoid infrared losses for the bottom cell and to reduce the bulkiness of the mechanical stack (only one substrate without any extra fixtures). At the same time, the released substrates can be reused, keeping the cell cost-efficient. Moreover, the cell is one-side contacted, allowing relatively easy interconnections. An efficiency of 23.4% was achieved (AM1.5g), for a thin GaAs solar cell mechanically stacked on a separate, inactive Ge substrate. The work towards realizing a 4-terminal GaAs-Ge mechanical dual junction stack and eventually a triple-junction InGaP-GaAs-Ge mechanical stack is currently ongoing.
Starting Page	000202
Ending Page	000205
File Size	854870
Page Count	4
File Format	PDF
ISBN	9781424429493
ISSN	01608371
DOI	10.1109/PVSC.2009.5411696
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-07
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Photovoltaic cells Gallium arsenide Wafer bonding Stacking MOCVD Contacts Roads Photonic band gap Lattices Paper technology
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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