NDLI: Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design

Content Provider	IEEE Xplore Digital Library
Author	Andrei, A. Tutunjyan, N. Verbinnen, G. VanPut, S. Krylychkina, O. Eberle, W. Musa, S.
Copyright Year	2012
Description	Author affiliation: CMP & Thinning Group, Imec, Leuven, Belgium (Verbinnen, G.) \|\| Dry Etch Group, Imec, Leuven, Belgium (Tutunjyan, N.) \|\| Bio-Electron. Syst. Group, Imec, Leuven, Belgium (Andrei, A.; Krylychkina, O.; Eberle, W.; Musa, S.) \|\| Inf. Technol. Dept., CMST, Ghent, Belgium (VanPut, S.)
Abstract	A flexible neural implant was designed and fabricated using an novel integration approach that offers the advantages of both silicon and polymer based implants: high density electrodes and precise insertion on one side and mechanical flexibility suitable for reduced tissue strain due to micro-motion during chronic implantation on the other side. This was achieved by separating the device into silicon or polymer areas, depending on their desired functionality. The tip, where the recording and stimulation electrodes would be placed, was kept of silicon: a choice that doesn't call for any compromise to be made regarding the high density electrode and possible local circuit integration later on. The bevel shaped sharp silicon tip also proved to facilitate the probe insertion, offering a behavior very much similar to the classical rigid silicon probes. On the other side, most of the 1 cm long shank of the probe was made out of polyimide. This led to more than one order of magnitude reduction of the forces necessary to bend the shank. The flexible shank proved also to be more robust than silicon probes, sustaining significant deformation in any direction without fracture. The 9mm deep in-vivo implantation were successfully achieved without buckling for 10 μm/s and 100 μm/s insertion speeds.
Sponsorship	IEEE Eng. Medicine Biol. Soc.
Starting Page	3890
Ending Page	3893
File Size	1378304
Page Count	4
File Format	PDF
ISBN	9781424441198
ISSN	1557170X
e-ISBN	9781457717871
DOI	10.1109/EMBC.2012.6346817
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-08-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Probes Implants Polyimides Force Surface treatment
Content Type	Text
Resource Type	Article
Subject	Signal Processing Biomedical Engineering Health Informatics Computer Vision and Pattern Recognition

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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