NDLI: Mapping of solder mask covered interconnects on high density printed circuit board

Content Provider	IEEE Xplore Digital Library
Author	Cher Ming Tan Yan Xiong Tay Chun Wei Goh Tai Chong Chai
Copyright Year	2006
Description	Author affiliation: Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore (Cher Ming Tan; Yan Xiong Tay; Chun Wei Goh)
Abstract	As the density of interconnects on printed circuit board is increasing tremendously, the use of optical microscope for checking of open trace is running out of steam. While electron microscope has the required resolution, the presence of solder mask on the top surface of the board hinders its direct application. Recently, the method of capacitive coupling voltage contrast (CCVC) method showed the feasibility for such a checking around a small region where open circuit or broken trace is located. In this work, we extend the CCVC method to obtain a contrast map of interconnects on an entire printed circuit board. With the use of simple image processing on the contrast map, both interconnects and the site of open circuit can be observed, making it a useful quality and failure analysis tool for copper traces integrity test. Finite element modeling of the CCVC is also performed, and the results agree qualitative with the experimental results
Starting Page	885
Ending Page	888
File Size	1176023
Page Count	4
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342829
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Printed circuits Optical microscopy Circuit testing Electron optics Optical interconnections Electron microscopy Coupling circuits Voltage Image processing
Content Type	Text
Resource Type	Article

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