NDLI: Processing and electrical characterization of co-sintered composite glass ceramics

Content Provider	IEEE Xplore Digital Library
Author	Sunappan, V. Vadiveloo, P.L. Wai, L.L. Fan, W. Lu, C.W.
Copyright Year	2006
Description	Author affiliation: Singapore Inst. of Manuf. Technol. (Sunappan, V.)
Abstract	The demand for smaller size with increased functionality in electronic devices require new materials, which will allow integration of passives elements in substrate. Low temperature co-fired ceramic (LTCC) is a glass ceramic substrate technology that offers an excellent platform for multi-functional integration. This paper describes manufacturing challenges in co-sintering of composite dielectric materials in multi-layer configurations and the extraction of high-frequency electrical characteristics of fabricated embedded capacitors. Processing of LTCC composite materials with mixed dielectric properties required modified fabrication processes. A combination of the controlled printing process and the split-step lamination produced excellent planarity which rendered the substrate suitable for post firing processes such as flip chip or other components assembly. The extracted effective capacitance for electrode area of 2.3 times 2.3 mm $^{2}$ capacitors for high dielectric layer is approximately 15 times of that obtained from the normal tape. This is due to the high permittivity layer. With the integration of high permittivity tape, the capacitance is significantly higher than that of the normal tape. It was also observed that the self-resonant frequency is well beyond 1 GHz, even for the high permittivity tape integration
Starting Page	655
Ending Page	658
File Size	294454
Page Count	4
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342791
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Ceramics Dielectric substrates Permittivity Dielectric materials Capacitors Capacitance Temperature Pulp manufacturing Electric variables
Content Type	Text
Resource Type	Article

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