NDLI: Effect of electric current on the mechanical properties and interfacial microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag solder joints

Content Provider	IEEE Xplore Digital Library
Author	Kumar, A. Zhong Chen Wong, C.C. Mhaisalkar, S.G. Kripesh, V.
Copyright Year	2006
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Nanyang Technol. Univ., Singapore (Kumar, A.)
Abstract	The effect of electric current on the mechanical properties and interfacial microstructure of electroless Ni-P/Sn-3.5Ag and pure Ni/Sn-3.5Ag solder joints were investigated for different DC current densities ranging from 1 times $10^{3}$ to 3 times $10^{3}$ $A/cm^{2}.$ It was observed that electric current causes the brittle failure of solder joints and the tendency of brittle failure increases with the increase in current density. In most of the electrically-stressed samples, fracture occurred between brittle interfacial compounds (IFCs) and/or at the brittle solder/IFC interface rather than inside the ductile solder. The electric current induced brittle failure of solder joint was more prominent in the case of pure Ni as compared to the electroless Ni-P metallization. Microstructure analysis of fracture surfaces showed that in the case of pure Ni, the cohesive strength of Ni-Sn IFCs was very low as most of the brittle fractures occurred between the Ni-Sn IFCs, whereas in the case of electroless Ni-P, brittle fractures occurred mainly at the $Ni_{3}Sn_{4}/solder$ interface. Interfacial microstructure of solder joints revealed that electric current also influences the IFC growth depending on the metallization. In the case of pure Ni metallization, the thickness of $Ni_{3}Sn_{4}$ IFC formed at anode side Ni/Sn-3.5Ag interface (where electrons flow from solder to Ni) was thicker than that formed at cathode side Ni/Sn-3.5Ag interface (where electrons flow from Ni to solder). However in the case of electroless Ni-P metallization, no significant difference was observed in the thickness of $Ni_{3}Sn_{4}$ formed at the cathode side and anode side Ni-P/Sn-3.5Ag interfaces.
Starting Page	203
Ending Page	210
File Size	3673947
Page Count	8
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342716
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Mechanical factors Microstructure Soldering Metallization Tin Current density Anodes Electrons Cathodes Surface cracks
Content Type	Text
Resource Type	Article

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