NDLI: Reliability of microelectronic packages with tin-plated copper leads under high humidity operating environment

Content Provider	IEEE Xplore Digital Library
Author	Yeoh Lai Seng
Copyright Year	2006
Description	Author affiliation: Fairchild Semicond., Penang (Yeoh Lai Seng)
Abstract	Lead frame is the primary package metallurgical bond pad interface in microelectronic devices which provides external interconnection. The most predominant lead frame material is copper with tin plating. Over the years, galvanic corrosion and copper oxidation are two main reliability concerns for any microelectronics packages with copper lead frame, when operating under high humidity environment. In our reliability lab, we frequently encountered corrosion and oxidation on the leads backside of certain devices which had undergone autoclave stress. Often, this observation is correlated to the rise in drain-to-source on-resistance. Failure analysis result revealed that non-homogeneous tin plating is the contributing factor. In the past, our operators utilized conventional cleaning method, that is, polished leads backside with sandpaper followed by acetone rinse. Nevertheless, this could not remedy the problem effectively. We have performed research study to prove that solder dip is a better solution to eliminate corrosion and oxidation away from the leads.
Starting Page	894
Ending Page	899
File Size	748713
Page Count	6
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342831
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectronics Packaging Copper Humidity Lead Corrosion Oxidation Tin Bonding Galvanizing
Content Type	Text
Resource Type	Article

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