NDLI: Micro- and nano-DIC deformation analysis for electronic packaging applications

Content Provider	IEEE Xplore Digital Library
Author	Yaofeng Sun Pang, J.H.L. Fan Wei Xunqing Shi
Copyright Year	2006
Description	Author affiliation: Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ. (Yaofeng Sun; Pang, J.H.L.)
Abstract	This paper presents an automated digital image correlation (DIC) system for in-plane micro-deformation analysis. The system features microscale resolution, realtime thermal ramp and cycling loading, image auto-positioning and autofocus for image acquisition, and novel element-based DIC algorithm. The DIC tool is demonstrated to a micro-deformation measurement application of a solder joint in a plastic ball grid array (BGA) package. The solder joint deformation has been investigated under two loading cases, temperature ramp and temperature cycling. Finite element analysis was conducted and the U and V displacements, and calculated strain distribution in the solder joint is compared with the DIC measured result. The measured and predicted displacement fields under temperature ramp give good agreement. Research on nano-scale DIC measurements must employ an atomic force microscope (AFM) for in-situ digital imaging of in-plane deformation. It was discovered through calibration that AFM scanner drift is a intrinsic error and thus a correction methodology is required for DIC application. The application the AFM/DIC technique is used for deformation characterization of solder interconnection in a micro-thermoelectric cooler system subject to a small temperature gradient of +25C to -25C
Starting Page	290
Ending Page	296
File Size	952518
Page Count	7
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342731
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Temperature Soldering Digital images Strain measurement Displacement measurement Atomic measurements Force measurement Atomic force microscopy Image analysis
Content Type	Text
Resource Type	Article

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